Thin film transistor array substrate with improved test terminals

ABSTRACT

A thin film transistor array substrate comprises thin film transistors and pixel electrodes formed at respective pixels that are defined by gate lines and data lines that orthogonally intersect each other. The thin film transistor array substrate further comprises a plurality of gate pad units that group a plurality of gate pads extended from the gate lines, and a plurality of data pad units that groups a plurality of data pads extended from the data lines. The thin film transistor array substrate further includes a plurality of gate test terminals connected to the gate pad units and beside at least one side of the respective gate pad units, and a plurality of data test terminals connected to the data pad units and located beside at least one side of the respective data pad units.

The present patent document is a divisional of U.S. patent applicationSer. No. 11/479,860, filed Jun. 29, 2006, which claims priority toKorean Application No. 10-2005-0080149 filed on Aug. 30, 2005, which arehereby incorporated by reference.

FIELD

The present invention relates to a method for manufacturing a liquidcrystal display device, and more particularly, to a method formanufacturing a liquid crystal display device for preventing the delayof signals in a vision auto probe (VAP) test.

BACKGROUND

As well known, liquid crystal display (LCD) devices have a high contrastratio and low energy consumption, and are suitable to display gray scaleimages and moving images. Thus, LCD devices are most widely used as arepresentative example of flat panel display devices, and are beingactively developed.

In particular, because of a lot of outstanding advantages such asthinness, light weight, and considerably reduced energy consumption ascompared to cathode ray tubes (CRTs), various applications of LCDdevices are possible in association with not only ultra-thin displaydevices of wall mounted TV sets, but also monitors of notebook computersthat use a battery as a power source. Accordingly, LCD devices arehighlighted as next-generation display devices.

Such an LCD device generally includes a thin film transistor arraysubstrate in which thin film transistors and pixel electrodes are formedat respective pixel defined by gate lines and data lines, a color filterlayer array substrate having a color filter layer and common electrode,and a liquid crystal layer interposed between the two substrates. In theliquid crystal display device having the above described configuration,liquid crystal molecules of the liquid crystal layer are rearranged whena voltage is applied to electrodes. The quantity of light passingthrough the liquid crystal layer is regulated based on the degree ofrearrangement of the liquid crystal molecules, to display an image.

In this case, both the color filter layer array substrate and the thinfilm transistor array substrate are bonded to each other by a sealantsuch as epoxy resin. The thin film transistor array substrate isconnected to drive circuits on a printed circuit board (PCB).

Specifically, as shown in FIG. 1, the thin film transistor arraysubstrate 10 is divided into an active region 10 a at the inside of adotted line, the active region being an image display region, and a padunit region 10 b at the outside of the dotted line. The active region 10a includes a plurality of gate lines 61 and data lines 62 orthogonallyintersecting each other to define unit pixels, and thin film transistors(TFTs) formed at intersections of the gate lines 61 and data lines 62.The unit pixels include pixel electrodes 70, respectively. The pixelelectrodes 70 are connected to the respective TFTs, to display an imageby switching of the respective TFTs.

The pad unit region 10 b includes gate pads 61 a and data pads 62 awhich are extended from the gate lines 61 and data lines 62,respectively. The gate pads 61 a and data pads 62 a are connected toexternal drive circuits, respectively, by interposing gate drive ICs anddata drive ICs, to receive various control signals and data signals. Theexternal drive circuits are integrated on a board, more particularly, aprinted circuit board, and are adapted to produce the various controlsignals and data signals required to drive the LCD device.

Specifically, the gate pads 61 a serve to apply scan signals in sequenceto the plurality of gate lines arranged in the active region, and thedata pads 62 a serve to apply data signals in sequence to the pluralityof data lines arranged in the active region.

When the gate lines receive the scan signals via the gate pads, and thusthe TFTs that are connected to the gate lines are turned on, the datasignals applied from the data pads are transmitted to the respectivepixel electrodes, so as to display an image.

Prior to being bonded to the color filter layer array substrate, theabove described thin film transistor array substrate must be subjectedto a mass production system (MPS) test for testing various defects suchas line defects and point defects. In the MPS test, a signal voltage isapplied to the thin film transistor array substrate via the gate padsand data pads that are connected to the gate lines and data lines in theactive region, respectively, to determine whether or not the thin filmtransistor array substrate has defects.

For example, to perform a vision auto probe (VAP) test for testingdefects of the respective unit pixels, probes, to which predeterminedsignals are applied, are accurately aligned with the gate pads and datapads, such that the gate pads receive the associated predeterminedsignals and the data pads receive the associated predetermined signals.In accordance with the reception results, it can be confirmed whether ornot a desired image is displayed on the respective unit pixels. In thiscase, a VAP test apparatus is divided into a panel having the probes forapplying the predetermined signals to the gate pads and a panel havingthe probes for applying the predetermined signals to the data pads. Theprobes are fabricated to be accurately aligned with the gate pads anddata pads, respectively.

However, the conventional liquid crystal display device has thefollowing problems.

The plurality of gate pads and data pads, which are extended from thegate lines and data lines, are divided into several groups. With thisarrangement, however, widths between the gate pads and between the datapads are narrow, and each of the gate pads and data pads has a smallsize, making it difficult for the probes to come into accurate contactwith the gate pads and data pads. When the probes fail to contact ataccurate positions, it is impossible to apply the predetermined signalsto the gate pads and data pads, and therefore, defects of pixels cannotbe confirmed.

SUMMARY

Accordingly, the present invention is directed to a liquid crystaldisplay device that substantially obviates one or more problems due tolimitations and disadvantages of the related art.

A thin film transistor array substrate comprises thin film transistorsand pixel electrodes formed at respective pixels that are defined bygate lines and data lines intersecting each other. The thin filmtransistor array substrate further comprises a plurality of gate padunits obtained by grouping a plurality of gate pads that are extendedfrom the gate lines and a plurality of data pad units obtained bygrouping a plurality of data pads that are extended from the data lines.The thin film transistor array substrate further includes test terminalunits comprising at least one of gate test terminal units or data testterminal units, wherein the gate test terminal units include a pluralityof gate test terminals and are provided adjacent to at least one side ofthe gate pad units to be connected thereto, and the data test terminalunits include a plurality of data test terminals and are providedadjacent to at least one side of the data pad units to be connectedthereto.

That is, instead of directly aligning probes of a VAP test apparatuswith the gate pad units and data pad units, the probes of the VAP testapparatus are brought into contact with the gate test terminals and datatest terminals which are provided beside the respective gate pad unitsand data pad units to be connected thereto, so as to apply test signalsto the gate pad units and data pad units.

A method of fabricating a thin film transistor array substrate comprisesforming thin film transistors and pixel electrodes at respective pixelsdefined by gate lines and data lines that intersect each other andforming a plurality of gate pad units that group a plurality of gatepads extended from the gate lines. The method of fabricating a thin filmtransistor array substrate further comprises forming a plurality of datapad units that group a plurality of data pads extended from the datalines and forming test terminal units comprising at least one of gatetest terminal units or data test terminal units, wherein the gate testterminal units include a plurality of gate test terminals and areprovided adjacent to at least one side of the gate pad units to beconnected thereto, and the data test terminal units include a pluralityof data test terminals and are provided adjacent to at least one side ofthe data pad units to be connected thereto.

A method of testing a thin film transistor array substrate comprisesproviding a thin film transistor array substrate and applying testsignals to at least one of the plurality of gate pads via the gate testterminals, or the plurality of data pads via the data test terminals.

It is to be understood that both the foregoing general description andthe following detailed description of the present invention areexemplary and explanatory and are intended to provide furtherexplanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this application, illustrate embodiment(s) of the invention andtogether with the description serve to explain the principle of theinvention. In the drawings:

FIG. 1 is a plan view showing a conventional liquid crystal displaydevice;

FIG. 2 is a plan view showing a liquid crystal display device inaccordance with a first embodiment of the present invention;

FIG. 3 is an enlarged plan view of oval “A” of FIG. 2;

FIG. 4 is a plan view showing a liquid crystal display device inaccordance with a second embodiment of the present invention;

FIG. 5 is an enlarged plan view of oval “B” of FIG. 4;

FIG. 6 is a plan view showing a gate pad unit in accordance with thepresent invention; and

FIG. 7 is a plan view showing a data pad unit in accordance with thepresent invention.

DETAILED DESCRIPTION

Reference will now be made in detail to the preferred embodiments of thepresent invention, examples of which are illustrated in the accompanyingdrawings. Wherever possible, the same reference numbers will be usedthroughout the drawings to refer to the same or like parts.

FIG. 2 is a plan view showing a liquid crystal display device inaccordance with a first embodiment of the present invention, and FIG. 3is an enlarged plan view of oval “A” of FIG. 2.

As shown in FIG. 2, a thin film transistor array substrate 110 accordingto the present invention is divided into an active region 110 a at theinside of a dotted line, the active region being an image displayregion, and a pad unit region 110 b at the outside of the dotted line.

The active region 110 a includes a plurality of gate lines 161 and datalines 162, orthogonally intersecting each other to define unit pixels.Thin film transistors (TFTs) are formed at intersections of the gatelines 161 and data lines 162. The unit pixels are formed with pixelelectrodes 170, respectively. The pixel electrodes 170 are connected tothe respective TFTs, to display an image in accordance with theswitching of the respective TFTs. Each of the TFTs includes a gateelectrode branched from the relevant gate line, a gate insulation filmformed over the entire surface thereof including the gate electrode, anactive layer formed on the gate insulation film at a position above thegate electrode, and source/drain electrodes formed at opposite ends ofthe active layer while being branched from the relevant data line.

The pad unit region 110 b includes a plurality of gate pads and datapads extended from the gate lines 161 and data lines 162, respectively.The gate pads and data pads are divided into groups to form one or moregate pad units 171, each including the plurality of gate pads, and oneor more data pad units 172, each including the plurality of data pads.In this case, the gate pad units and data pad units are connected toexternal drive circuits such that various control signals and datasignals produced from the external drive circuits can be applied to theactive region.

Prior to connecting the external drive circuits, it is desirable to testdefects of a liquid crystal panel such as line defects and pointdefects. Thus, gate test terminals and data test terminals are connectedto the gate pads and data pads, respectively, to apply a predeterminedvoltage to the gate pads and data pads.

Specifically, the gate test terminal unit 181 consisting of a number (n)of gate test terminals (here, letter “n” denotes a natural number morethan 1) is provided at a side of each gate pad unit 171 such that thepredetermined voltage is applied to the gate pad unit 171 via the gatetest terminals in order to test defects of the associated pixel. In thiscase, each of the gate test terminals is indirectly connected to theassociated gate pads through a gate terminal line that is integrallyextended from a distal end of the gate test terminal.

That is, (mn+1)th gate pads of the gate pad unit are brought intocontact with a first test terminal, (mn+2)th gate pads are brought intocontact with a second test terminal, and (mn+3)th gate pads are broughtinto contact with a third test terminal Such a method, consequently, ischaracterized in that (mn+n)th gate pads of any one gate pad unit arebrought into contact with an (n)th test terminal of the associated gatetest terminal that is provided at a side of the gate pad unit (here,letter “m” denotes a natural number more than zero).

Similarly, the data test terminal unit 182 consisting of a number (f) ofdata test terminals 582 (here, letter “f” denotes a natural number morethan 1) are provided at a side of each data pad unit 172 such that thepredetermined voltage is applied to the data pad unit 172 via the datatest terminals 582 in order to test defects of the associated pixel. Inthis case, each of the data test terminals is connected to theassociated data pads through a data terminal line that is integrallyextended from a distal end of the data test terminal

That is, (kf+1)th data pads of the data pad unit are brought intocontact with a first data test terminal, (kf+2)th data pads are broughtinto contact with a second data test terminal, and (kf+3)th data pads ofany one data pad unit are brought into contact with a third data testterminal Such a method, consequently, is characterized in that (kf+f)thdata pads are brought into contact with an (f)th data test terminal ofthe associated data test terminal that is provided at a side of the datapad unit (here, letter “k” denotes a natural number more than zero).

For example, as shown in FIG. 3, if six data test terminals 582 of anyone data test terminal unit 182 are arranged at a side of one of thedata pad units, and the data test terminals are connected to dataterminal lines 192, respectively, each of the data pads is electricallyconnected to the associated data terminal line and data test terminalvia an associated hole of first contact holes 201.

That is, first, second, third, fourth, fifth, and sixth data pads 172 aof the data pad unit are brought into contact with the six data testterminals in sequence. Also, seventh, eighth, ninth, tenth, eleventh,and twelfth data pads are brought into contact with the six data testterminals in sequence. Similarly, thirteenth, fourteenth, fifteenth,sixteenth, seventeenth, and eighteenth data pads are brought intocontact with the six data test terminals in sequence. In such a method,all data pads 172 a of any one data pad unit 172 are brought intocontact with the data test terminals of any one data test terminal unit182 that are located at a side of the data pad unit.

In conclusion, the present invention is characterized in that probes ofa VAP test apparatus are aligned with gate test terminal units and datatest terminal units that are additionally provided at the thin filmtransistor array substrate, other than being directly aligned with thegate pads and data pads. This has the effect of preventing a test defectdue to misalignment between the probes and pad electrodes, and achievingan enlargement of the gate test terminals and data test terminals, andresulting in a sufficient probe contact margin.

However, due to the fact that such a test terminal unit is provided onlyat one side of the pad unit, the greater the distance between the padelectrodes and the test terminals, the greater the delay of test signalsdue to a resistance based on the distance. This may make the results ofthe test inaccurate.

Accordingly, it is desirable that two test terminal units be provided atopposite sides of the pad unit to apply a test voltage to the pad unit.FIG. 4 is a plan view showing a liquid crystal display device inaccordance with a second embodiment of the present invention. FIG. 5 isan enlarged plan view of oval “B” of FIG. 4.

As shown in FIG. 4, in association with a plurality of gate pad unitseach consisting of a plurality of gate pads, first and second gate testterminal units 181 a and 181 b consisting of a number (n) of gate testterminals are provided at opposite sides of each gate pad unit 171,respectively (here, letter “n” denotes a natural number more than 1),such that a predetermined voltage is simultaneously applied via both thefirst gate test terminals and second gate test terminals in order totest defects of the associated pixel. In this case, the first and secondgate test terminals are connected to the respective gate pads via gateterminal lines that are integrally formed with the gate test terminals.

That is, (mn+1)th gate pads of the gate pad unit 171 are brought intocontact with the first gate test terminals in the first and second gatetest terminal units, (mn+2)th gate pads of the gate pad unit 171 arebrought into contact with the second gate test terminals in the firstand second gate test terminal units, and (mn+3)th gate pads of the gatepad unit 171 are brought into contact with the third gate test terminalsin the first and second gate test terminal units (here, letter “m”denotes a natural number more than zero).

Such a method, consequently, is characterized in that (mn+n)th gate padsof any one gate pad unit are brought into contact with (n)th gate testterminals in the associated first and second gate test terminal unitsthat are provided at opposite sides of the gate pad unit. Further, it ischaracterized in that (n)th gate test terminals in the first and secondgate test terminal units are integrally connected to each other via asingle (n)th gate terminal line.

Similarly, in association with a plurality of data pad units eachconsisting of a plurality of data pads, a first data test terminal 182 aconsisting of a number (f) of first data test terminals 582 a and asecond data test terminal 182 b consisting of a number (f) of seconddata test terminals 582 b are provided at opposite sides of each datapad unit 172, respectively (here, letter “f” denotes a natural numbermore than 1), such that a predetermined voltage is simultaneouslyapplied via both the first data test terminals 582 a and second datatest terminals 582 b in order to test defects of the associated pixel.In this case, the first and second data test terminals are connected tothe respective data pads via data terminal lines that are integrallyextended from distal ends of the data test terminals.

That is, (kf+1)th data pads of the data pad unit are brought intocontact with the first data test terminals in the first and second datatest terminal units, (kf+2)th data pads of the data pad unit are broughtinto contact with the second data test terminals in the first and seconddata test terminal units, and (kf+3)th data pads of the data pad unitare brought into contact with the third data test terminals in the firstand second data test terminal units (here, letter “k” denotes a naturalnumber more than zero).

Such a method, consequently, is characterized in that (kf+f)th data padsof any one data pad unit are brought into contact with (f)th data testterminals in the associated first and second data test terminal unitsthat are provided at opposite sides of the data pad unit. Further, it ischaracterized in that (f)th data test terminals in the first and seconddata test terminal units are integrally connected to each other via asingle (f)th gate terminal line.

For example, as shown in FIG. 5, if six data test terminals 582 a andsix data test terminals 582 b are arranged at opposite sides of one ofthe data pad units, respectively, and the data test terminals areintegrally connected to the respective data terminal lines 192, each ofthe data pads is electrically connected to the associated data terminalline and data test terminal via one of the first contact holes 201.

That is, first, second, third, fourth, fifth, and sixth data pads 172 aof the data pad unit are brought into contact with the six first datatest terminals 582 a and six second data test terminals 582 b via theassociated first contact holes 201 in sequence. Also, seventh, eighth,ninth, tenth, eleventh, and twelfth data pads are brought into contactwith the six first data test terminals 582 a and six second data testterminals 582 b in sequence. Similarly, thirteenth, fourteenth,fifteenth, sixteenth, seventeenth, and eighteenth data pads are broughtinto contact with the six first data test terminals 582 a and six seconddata test terminals 582 b in sequence. In such a method, all data padsof any one data pad unit are brought into contact with the first andsecond data test terminals.

In this case, the first data test terminals in the first and second datatest terminal units are integrally connected to each other via the firstdata terminal line, and the second data test terminals in the first andsecond data test terminal units are integrally connected to each othervia the second data terminal line. In such a method, (f)th data testterminals in the first and second data test terminal units areintegrally connected to each other by an (f)th data terminal line.

In conclusion, as a result of connecting two test terminals to a singlepad to apply a test signal to each pad electrode via the two testterminals, the delay of test signals depending on a distance between thetest terminals and the pad electrode can be minimized, resulting in amore accurate test.

Further, in a chip on glass (COG) manner wherein drive ICs are directlymounted on the TFT array substrate, more particularly, in a line onglass (LOG) manner wherein LOG lines are directly mounted on the TFTarray substrate, the LOG lines must be formed even in corners of thesubstrate (circle “C” of FIG. 4). Accordingly, no gate test terminalunit and data test terminal unit can be formed in the region “C” in LOGmanner.

The gate test terminals (including the gate terminal lines) and datatest terminals (including the data terminal lines) as stated above areseparated from the gate pads and data pads respectively in order toprevent a short circuit between the test terminals and pad electrodes.The individually formed gate and data test terminals are thenelectrically connected to the gate and data pads by use of connectionpatterns that are formed on an uppermost layer of the TFT arraysubstrate.

FIG. 6 is a plan view showing a gate pad unit in accordance with thepresent invention. FIG. 7 is a plan view showing a data pad unit inaccordance with the present invention.

Specifically, as shown in FIG. 6, the gate pads 171 a are extended fromdistal ends of the gate lines (see reference numeral 161 of FIG. 2), andthe gate terminal lines 191 are provided on the outside of the gatepads. The gate terminal lines 191 are integrally formed at distal endsthereof with test terminals, respectively. In this case, the connectionpatterns 200 are used for the contact between the gate terminal linesand the gate pads. Thus, the connection patterns 200 are electricallyconnected to the gate pads 171 a via second contact holes 202 whilebeing brought into contact with the gate terminal lines 191 via thefirst contact holes 201. The connection patterns 200 are formed in thesame layer as pixel electrodes of the active region.

Meanwhile, gate shorting bars 204 are further provided on the outside ofthe gate terminal lines to be electrically connected to the gate pads.To connect the gate pads to the gate shorting bars, the connectionpatterns 200 are extended to the gate shorting bars 204 and are broughtinto contact with the gate shorting bars 204 via third contact holes203. Generally, the gate shorting bars include a first gate shorting bar204 a to be connected to the gate pads corresponding to odd numbers, anda second gate shorting bar 204 b to be connected to the gate padscorresponding to even numbers. The first and second gate shorting barsare used to detect whether or not the gate lines exhibit a short circuitby a difference of voltages applied to the gate lines.

The gate terminal lines 191 and gate shorting bars 204 may be formed inthe same layer as the gate pads 171 a. In this case, the first, second,and third contact holes 201, 202, and 203 are formed by removing aninsulation film that is interposed between the gate line layer and theconnection patterns. Generally, the gate line layer is made of AlNdhaving a low specific resistance, and therefore, can minimize an areaoccupied by the gate terminal lines.

Meanwhile, as shown in FIG. 7, the data terminal lines 192, which areintegrally formed with the data test terminals, are electricallyconnected to the data pads 172 a by use of the connection patterns 200.The data pads 172 a are extended from distal ends of the data lines (seereference numeral 162 of FIG. 2) and the data terminal lines 192 areprovided on the outside of the data pads. In this case, the connectionpatterns 200 are used for the contact between the data terminal linesand the data pads. Thus, the connection patterns 200 are electricallyconnected to the data pads 172 a via the second contact holes 202 whilebeing brought into contact with the data terminal lines 192 via thefirst contact holes 201. The connection patterns 200 are provided in thesame layer as the pixel electrodes of the active region.

Data shorting bars 304 are further provided on the outside of the dataterminal lines to be electrically connected to the data pads. To connectthe data pads to the data shorting bars, the connection patterns 200 areextended to the data shorting bars 304 and are brought into contact withthe data shorting bars 304 via the third contact holes 203. Generally,the data shorting bars include a first data shorting bar 304 a to beconnected to the data pads corresponding to odd numbers, and a seconddata shorting bar 304 b to be connected to the data pads correspondingto even numbers. The first and second data shorting bars are used todetect whether or not the data lines exhibit a short circuit by adifference of voltages applied to the data lines.

The data terminal lines 192 and data shorting bars 304 may be formed inthe same layer as the data pads 172 a. Generally, the data line layer ismade of molybdenum (Mo) having a specific resistance of 0.15Ω/μm, andtherefore, inevitably has a large width to prevent line resistance frombeing high. Accordingly, it is desirable that the data terminal linesand data shorting bars be simultaneously formed with the gate line layerin order to minimize an area occupied by the data terminal lines. Inthis case, the gate line layer is made of AlNd having a specificresistance of 0.05Ω/μm.

As stated above, when the data terminal lines and data shorting bars aresimultaneously formed with not the data line layer but the gate linelayer, the data shorting bars may each have a width of about 50 to about60 μm, and the six data terminal lines may each have a width of about170 μm, thereby reducing the sizes of the data shorting bars and dataterminal lines.

For reference, reference numeral 500 of FIGS. 6 and 7 denotes atransparent conductive film, which is configured to cover exposedregions of the gate pads 171 a and data pads 172 a, thereby protectingthe gate pads and data pads that are liable to be oxidized in theatmosphere. The transparent conductive film 500 is formed in the samelayer as the connection patterns 200. The transparent conductive filmand connection patterns are formed in the same layer as the pixelelectrodes of the active region, and are made of indium tin oxide (ITO)and indium zinc oxide (IZO).

In the thin film transistor array substrate having the above describedconfiguration, a short circuit between the gate lines and the data linesis detected by applying a predetermined voltage to the gate shortingbars and data shorting bars. That is, after applying a predeterminedvoltage to the shorting bars that are connected to the linescorresponding to odd numbers and the shorting bars that are connected tothe lines corresponding to even numbers, resistance values of therespective lines are measured, so as to detect a short circuit of thelines.

Thereafter, a predetermined voltage is applied to the gate testterminals and data test terminals, to detect whether or not the TFT ofeach pixel is accurately driven. That is, differently from a prior artmethod wherein probes are aligned with the respective gate pads and datapads to apply predetermined signals to the gate pads and data pads,according to the present invention, the probes are aligned with the testterminals that are connected to the gate pads and data pads to applysignals required to confirm defects of each pixel. Since the testterminals have a larger size than the gate pads, aligning the probeswith the test terminals can reduce the risk of misalignment of theprobes.

Here, regions where the gate shorting bars and data shorting bars areformed will be removed in the scribing process, wherein the TFT arraysubstrate and color filter layer array substrate bonded to each otherare cut, after applying the predetermined voltage to the shorting barsso as to detect the short circuit of the lines. Hereinafter, the probesare aligned with the test terminals to apply signals required to confirmdefects of each pixel according to the present invention. And then,regions where the gate test terminals and data test terminals are formedwill be removed in the grinding process, wherein the edges of the TFTarray substrate and color filter layer array substrate cut are grinded.Thus, partial regions on the outside of the gate test terminals and datatest terminals can be subjected to scribing and grinding processes.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the present inventionwithout departing from the spirit or scope of the inventions. Thus, itis intended that the present invention covers the modifications andvariations of this invention provided they come within the scope of theappended claims and their equivalents.

For example, the number of the gate test terminals and data testterminals are not limited to the above described embodiments, andvarious modifications and variations thereof can be made in the presentinvention without departing from the spirit or scope of the inventions.

As apparent from the above description, the thin film transistor arraysubstrate of the present invention has the following effects.

Firstly, instead of directly aligning probes of a test apparatus withgate pads and data pads, according to the present invention, the probesare aligned with gate test terminals and data test terminals, which areadditionally provided at the thin film transistor array substrate, tocheck defects of pixels by applying test signals to the test terminals.This has the effect of eliminating a test defect due to misalignmentbetween the probes and pad electrodes, and achieving an enlargement ofthe gate test terminals and data test terminals, resulting in asufficient probe contact margin.

Secondly, in addition to providing a test terminal unit only at a sideof a pad unit, according to the present invention, two test terminalunits may be provided at opposite sides of the pad unit to apply a testvoltage to a single pad electrode. This can minimize the delay of testsignals which becomes worse as the distance between the test terminalsand pad electrodes increases. As a result, defects of pixels can be moreefficiently tested.

1. A method of fabricating a thin film transistor array substratecomprising: forming thin film transistors and pixel electrodes atrespective pixels defined by gate lines and data lines that intersecteach other; forming a plurality of gate pad units that group a pluralityof gate pads extended from the gate lines; forming a plurality of datapad units that group a plurality of data pads extended from the datalines; forming test terminal units comprising at least one of gate testterminal units or data test terminal units, wherein the gate testterminal units include a plurality of gate test terminals and areprovided adjacent to at least one side of the gate pad units to beconnected thereto, and the data test terminal units include a pluralityof data test terminals and are provided adjacent to at least one side ofthe data pad units to be connected thereto; forming gate terminal linesextended from the respective plurality of gate test terminals on theoutside of the plurality of gate pads; and forming gate shorting barsprovided on the outside of the gate terminal lines and connected to theplurality of gate pads, wherein the gate shorting bars each have a widthof about 50 to about 60 μm, and the gate terminal lines each have awidth of about 170 μm.
 2. The method of fabricating a thin filmtransistor array substrate as set forth in claim 1, wherein the testterminal units comprise both gate test terminal units and data testterminal units.
 3. The method of fabricating a thin film transistorarray substrate as set forth in claim 1, wherein test signals areapplied to the plurality of gate pads via the gate test terminals. 4.The method of fabricating a thin film transistor array substrate as setforth in claim 1, wherein test signals are applied to the plurality ofdata pads via the data test terminals.
 5. The method of fabricating athin film transistor array substrate as set forth in claim 1, whereinthe plurality of gate test terminals are divided into groups such thateach group, consisting of a number (n) of gate test terminals (here,letter “n” denotes a natural number more than 1), is connected to anassociated one of the plurality of gate pad units.
 6. The method offabricating a thin film transistor array substrate as set forth in claim1, wherein the plurality of gate test terminals are provided at one sideof the respective plurality of gate pad units.
 7. The method offabricating a thin film transistor array substrate as set forth in claim1, wherein the plurality of gate test terminals include first gate testterminals and second gate test terminals such that the first gate testterminals and the second gate test terminals are provided at oppositesides of the respective plurality of gate pad units.
 8. The method offabricating a thin film transistor array substrate as set forth in claim7, wherein an (n)th gate test terminal of the first gate test terminalsis integrally connected with an (n)th gate test terminal of the secondgate test terminals to come into contact with the same gate pads in theplurality of gate pad units as each other (here, letter “n” denotes anatural number more than 1).
 9. The method of fabricating a thin filmtransistor array substrate as set forth in claim 1, wherein theplurality of gate test terminals are provided in the same layer as thegate lines.
 10. The method of fabricating a thin film transistor arraysubstrate as set forth in claim 9, wherein the plurality of gate testterminals are made of AINd.
 11. The method of fabricating a thin filmtransistor array substrate as set forth in claim 1, wherein theplurality of data test terminals are divided into groups such that eachgroup, consisting of a number (f) of data test terminals (here, letter“f” denotes a natural number more than 1), is connected to an associatedone of the plurality of data pad units.
 12. The method of fabricating athin film transistor array substrate as set forth in claim 1, whereinthe plurality of data test terminals are provided at one side of therespective plurality of data pad units.
 13. The method of fabricating athin film transistor array substrate as set forth in claim 1, whereinthe plurality of data test terminals include first data test terminalsand second data test terminals such that the first data test terminalsand the second data test terminals are provided at opposite sides of therespective plurality of data pad units.
 14. The method of fabricating athin film transistor array substrate as set forth in claim 13, whereinan (f)th data test terminal of the first data test terminals isintegrally connected with an (f)th data test terminal of the second datatest terminals to come into contact with the same data pads in theplurality of data pad units as each other (here, letter “f” denotes anatural number more than 1).
 15. The method of fabricating a thin filmtransistor array substrate as set forth in claim 1, wherein theplurality of data test terminals are provided in the same layer as thedata lines.
 16. The method of fabricating a thin film transistor arraysubstrate as set forth in claim 1, wherein the plurality of data testterminals are made of AINd in the same layer as the gate lines.
 17. Themethod of fabricating a thin film transistor array substrate as setforth in claim 1, wherein the plurality of gate pads are brought intocontact with the gate terminal lines by use of connection patternsprovided in the same layer as the pixel electrodes.
 18. The method offabricating a thin film transistor array substrate as set forth in claim1, wherein the gate shorting bars include a first gate shorting barconnected to the plurality of gate pads corresponding to odd numbers,and a second gate shorting bar connected to the plurality of gate padscorresponding to even numbers.
 19. The method of fabricating a thin filmtransistor array substrate as set forth in claim 1, wherein the gateterminal lines and the gate shorting bars are formed in the same layeras the plurality of gate pads.
 20. The method of fabricating a thin filmtransistor array substrate as set forth in claim 1, further comprising:forming data terminal lines extended from the respective plurality ofdata test terminals on the outside of the plurality of data pads. 21.The method of fabricating a thin film transistor array substrate as setforth in claim 20, wherein the plurality of data pads are brought intocontact with the data terminal lines by use of connection patternsprovided in the same layer as the pixel electrodes.
 22. The method offabricating a thin film transistor array substrate as set forth in claim20, further comprising: forming data shorting bars provided on theoutside of the data terminal lines and connected to the plurality ofdata pads.
 23. The method of fabricating a thin film transistor arraysubstrate as set forth in claim 22, wherein the data shorting barsinclude a first data shorting bar connected to the plurality of datapads corresponding to odd numbers, and a second data shorting barconnected to the plurality of data pads corresponding to even numbers.24. The method of fabricating a thin film transistor array substrate asset forth in claim 22, wherein the data terminal lines and the datashorting bars are formed in the same layer as the plurality of datapads.
 25. The method of fabricating a thin film transistor arraysubstrate as set forth in claim 1, wherein test terminals of the testterminal units have larger size than the gate pads of the plurality ofgate pad units or data pads of the plurality of data pad units.
 26. Amethod of fabricating a liquid crystal display device comprising:providing a thin film transistor array substrate as set forth in claim1; bonding a color filter layer array substrate with the thin filmtransistor array substrate; cutting the two substrates in apredetermined size; grinding edges of the two substrates; and applyingtest signals to at least one of the plurality of gate pads via the gatetest terminals or the plurality of data pads via the data testterminals.
 27. The method of fabricating a liquid crystal display deviceas set forth in claim 26, wherein test signals are applied to both theplurality of gate pads via the gate test terminals and the plurality ofdata pads via the data test terminals.
 28. The method of fabricating aliquid crystal display device as set forth in claim 26, wherein theplurality of gate test terminals are provided at one side of therespective plurality of gate pad units.
 29. The method of fabricating aliquid crystal display device as set forth in claim 26, wherein theplurality of gate test terminals include first gate test terminals andsecond gate test terminals such that the first gate test terminals andthe second gate test terminals are provided at opposite sides of therespective plurality of gate pad units.
 30. The method of fabricating aliquid crystal display device as set forth in claim 26, wherein theplurality of data test terminals are provided at one side of therespective plurality of data pad units.
 31. The method of fabricating aliquid crystal display device as set forth in claim 26, wherein theplurality of data test terminals include first data test terminals andsecond data test terminals such that the first data test terminals andthe second data test terminals are provided at opposite sides of therespective plurality of data pad units.
 32. The method of fabricating aliquid crystal display device as set forth in claim 26, furthercomprising: forming gate terminal lines extended from the respectiveplurality of gate test terminals on the outside of the plurality of gatepads.
 33. The method of fabricating a liquid crystal display device asset forth in claim 32, wherein the plurality of gate pads are broughtinto contact with the gate terminal lines by use of connection patternsprovided in the same layer as the pixel electrodes.
 34. The method offabricating a liquid crystal display device as set forth in claim 32,further comprising: forming gate shorting bars provided on the outsideof the gate terminal lines and connected to the plurality of gate pads.35. The method of fabricating a liquid crystal display device as setforth in claim 34, wherein a region where the gate shorting bars areformed is removed in the step of cutting the two substrates in apredetermined size.
 36. The method of fabricating a liquid crystaldisplay device as set forth in claim 35, wherein a region where the gatetest terminal lines are formed is removed in the step of grinding theedges of the two substrates, after applying test signals to at least oneof the plurality of gate pads via the gate test terminals.
 37. Themethod of a liquid crystal display device as set forth in claim 26,further comprising: forming data terminal lines extended from therespective plurality of data test terminals on the outside of theplurality of data pads.
 38. The method of fabricating a liquid crystaldisplay device as set forth in claim 37, wherein the plurality of datapads are brought into contact with the data terminal lines by use ofconnection patterns provided in the same layer as the pixel electrodes.39. The method of fabricating a liquid crystal display device as setforth in claim 37, further comprising: forming data shorting barsprovided on the outside of the data terminal lines and connected to theplurality of data pads.
 40. The method of fabricating a liquid crystaldisplay device as set forth in claim 39, wherein a region where the datashorting bars are formed is removed in the step of cutting the twosubstrates in a predetermined size.
 41. The method of fabricating aliquid crystal display device as set forth in claim 40, wherein a regionwhere the data test terminal lines are formed is removed in the step ofgrinding the edges of the two substrates, after applying test signals toat least one of the plurality of data pads via the data test terminals.42. The method of fabricating a liquid crystal display device as setforth in claim 26, wherein test terminals of the test terminal unitshave larger size than the gate pads of the plurality of gate pad unitsor data pads of the plurality of data pad units.